Electronic device
AssigneeEverlight Electronics Co., Ltd.
InventorWen-Chieh Tsou
Life of this patent
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Abstract
An electronic device includes a carrier, a surface mounting device, and solders. The carrier has a plurality of bonding pads, and at least one of the bonding pads has a notch, such that the bonding pad has a necking portion adjacent to the notch. The surface mounting device is disposed on the carrier. Besides, the surface mounting device has a plurality of leads, and each of the leads is connected to the necking portion of one of the bonding pads, respectively. The notch of each of the bonding pads is located under one of the leads. The solders connect the bonding pads and the leads.
Claims20
An electronic device, comprising:
- a carrier having a plurality of bonding pads, wherein at least one of the bonding pads has a notch located at one side edge of the bonding pad, such that the bonding pad has a necking portion adjacent to the notch;
- a surface mounting device disposed on the carrier and having a plurality of leads, wherein each of the leads is connected to the necking portion of one of the bonding pads, respectively, and the notch of each of the bonding pads is located under one of the leads;
- and
- a plurality of solders connecting the bonding pads and the leads.
An electronic device, comprising:
- a carrier having a base layer, a solder mask layer covering the base layer and a plurality of bonding pads located on the base layer, each of the bonding pads having a first soldering portion and a second soldering portion and the first and second soldering portions are exposed by openings of the solder mask layer and are spaced apart;
- a surface mounting device disposed on the carrier and having a plurality of leads, wherein each of the leads is connected to the first soldering portion and the second soldering portion of the corresponding one of the bonding pads;
- and
- a plurality of solders connecting the bonding pads and the leads.
A circuit board for carrying a surface mounting device having at least one lead, the circuit board comprising:
- a base;
- a solder mask layer, covering the base;
- and
- at least a bonding pad exposed by the solder mask layer and located on the base for soldering to the lead of the surface mounting device, wherein the bonding pad comprises a notch located at one side edge of the bonding pad and a necking portion within an area for soldering.
A circuit board for carrying a surface mounting device having at least one lead, the circuit board comprising:
- a base;
- a soldering mask layer, covering the base;
- and
- at least a bonding pad exposed by the solder mask layer and located on the base for soldering to the lead of the surface mounting device, the bonding pad comprising at least two separated soldering portions spanning a distance corresponding to the lead in width.
Dependencies are inferred from the claim text.