US 8,283,784 B2 · Method for producing a power semiconductor module, and power semiconductor module comprising a connection device

Abstract

A method for making a power semiconductor module and a module produced by that method, wherein the module includes a substrate, a connection device and load terminal elements, wherein power semiconductor components are arranged on a conductor track of the substrate and connected to one of the load terminal element by the connection device. The power semiconductor module has auxiliary contact pads which can be connected to an external printed circuit board. The primary production step in this case is cohesively connecting respective first contact areas of the first conductor tracks to at least one second contact area of a power semiconductor component and at least one third contact area of a load terminal element; afterwards, the assemblage composed of at least one power semiconductor component of a connection device and load terminal elements is arranged to form a housing of the power semiconductor module.

Claims9

Dependent claims

A method for producing a power semiconductor module used for housing at least one power semiconductor, the power semiconductor including connectors for connecting to at least one load terminal element, the method comprising the steps of:

providing a substrate;
disposing a connection device which includes a layer sequence having a first electrically conductive structured metal film, an electrically insulating film and a second electrically conductive structured metal film, atop said substrate, said connection device also including auxiliary contact pads which are configured to connect to an external circuit;
forming respective first and second conductor tracks from the respective metal films;
cohesively connecting respective first contact areas of said first conductor tracks to at least one second contact area of the power semiconductor and at least one third contact area of the load terminal element thereby forming an assemblage of the at least one power semiconductor and said connection device and the load terminal elements;
and
arranging said assemblage to form a housing of the power semiconductor module.

3 more elements

A power semiconductor module comprising:

a substrate;
a connection device having a layer sequence of at least a first electrically conductive and structured metal film, an electrically insulating film and a second electrically conductive and structured film;
a plurality of load terminal elements for connecting to said power semiconductor component by said connection device, and
a housing for housing at least portions of said substrate, said connection device and said load terminal elements;
wherein the respective structurings of said first and second electrically conductive films form respective first and second conductor tracks configured to receive at least one power semiconductor component;
and
wherein at least one first conductor track has a contact area which is cohesively connected to at least one of said load terminal elements, and wherein said connection device has auxiliary contact pads configured to be connected to an external printed circuit board.

4 more elements

Dependencies are inferred from the claim text.

Method for producing a power semiconductor module, and power semiconductor module comprising a connection device

Life of this patent

Method for producing a power semiconductor module, and power semiconductor module comprising a connection device

Life of this patent

Abstract

Claims9