Loading patent…
AssigneesToyota Jidosha Kabushiki Kaisha, Tohoku University
InventorsYasushi Yamada, Yuji Yagi, Yoshikazu Takaku, Ikuo Ohnuma, Kiyohito Ishida, Takashi Atsumi, Ikuo Nakagawa, Mikio Shirai
Estimating the term…
A zinc based solder material 55 of the present invention is prepared by providing on the surface of a zinc based material 50, from which an oxide film 501 has been removed or at which an oxide film 501 does not exist, with a coating layer 51 containing primarily a metal whose oxide is more easily reducible than the oxide film 501. In a joined body and a power semiconductor module of the present invention, the zinc based solder material 55 is used in the joining portion, and after joining, the coating layer 51 does not exist.
A solder material comprising primarily zinc, wherein a surface of a material comprising primarily zinc, from which a natural oxide film has been removed, or at which a natural oxide film has not yet formed, is provided with a coating layer comprising primarily a metal whose oxide is more easily reducible than the natural oxide film when formed, and
A method for manufacturing a solder material comprising primarily zinc, comprising providing the surface of a material comprising primarily zinc, from which a natural oxide film has been removed or at which a natural oxide film has not yet formed, with a coating layer comprising primarily a metal whose oxide is more easily reducible than the natural oxide film when formed, and
Dependencies are inferred from the claim text.