Peel-resistant semiconductor device with improved connector density, and method of manufacturing the same
AssigneeElpida Memory, Inc.
InventorSeiya Fujii
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a substrate and a plurality of bumps. The substrate is compartmentalized into a bump-free area provided along four sides of the substrate and a bump area which is surrounded by the bump-free area. The plurality of bumps is aligned in the bump area. The plurality of bumps includes a first group of bumps aligned along the four sides and a second group of bumps surrounded by the first group. A first subgroup of bumps included in the first group and aligned along one side of the four sides is shifted with respect to a second subgroup of bumps included in the first group and aligned along an opposing side of the four sides in a direction parallel to the one side.
Claims19
A semiconductor device, comprising:
- a substrate having a first surface and a second surface opposing the first surface, the second surface being compartmentalized into a bump-free area provided along four sides of the substrate and a bump area which is surrounded by the bump-free area;
- a plurality of connection pads provided on the first surface of the substrate;
- a semiconductor chip mounted on the first surface of the substrate, the semiconductor chip being electrically coupled to the plurality of connection pads;
- and
- a plurality of bumps provided on the bump area of the second surface, the plurality of bumps being electrically coupled to the plurality of connection pads, respectively,
- wherein the plurality of bumps includes a first group of bumps aligned along the four sides and a second group of bumps surrounded by the first group, and a first subgroup of bumps included in the first group and aligned along one side of the four sides is shifted with respect to a second subgroup of bumps included in the first group and aligned along an opposing side of the four sides in a direction parallel to the one side.
A semiconductor device, comprising:
- a substrate including a first surface and a second surface opposed to the first surface, the second surface being defined by first and second side edges opposed to each other and by third and fourth side edges opposed to each other;
- a semiconductor chip mounted on the first surface of the substrate, the semiconductor chip being smaller in size than the substrate;
- a plurality of first bumps arranged along the first side edge of the second surface;
- and
- a plurality of second bumps arranged along the second side edge of the second surface,
- wherein the first and second bumps are positioned so that lines, extending respectively from the first bumps toward the second bumps and substantially parallel to the third side edge, are deviated from lines extending respectively from the second bumps toward the first bumps and substantially parallel to the third side edge.
A semiconductor device comprising:
- a substrate having a first surface delimited by first and second side edges opposed to each other and by third and fourth side edges opposed to each other;
- a plurality of first bumps arranged along the first side edge;
- a plurality of second bumps arranged along the second side edge;
- a plurality of third bumps arranged along the third side edge;
- a plurality of fourth bumps arranged along the fourth side edge;
- and
- a semiconductor chip mounted on a second surface of the substrate, the second surface opposing the first surface of the substrate, and the semiconductor chip being electrically coupled to the first, second, third, and fourth bumps,
- the first and second bumps being positioned so that lines, extending respectively from the first bumps and substantially parallel to the third side edge, are offset from lines that extend respectively from the second bumps and substantially parallel to the third side edge,
- the third and fourth bumps being positioned so that lines, extending respectively from the third bumps and substantially parallel to the first side edge, are offset from lines that extend respectively from the fourth bumps substantially parallel to the first side edge, and
- a distance between two adjacent ones of the first bumps is substantially equal to a distance between two adjacent ones of the third bumps.
Dependencies are inferred from the claim text.