Compressive ring structure for flip chip packaging
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPo-Yao Lin, Wen-Yi Lin
Life of this patent
Estimating the term…
Abstract
Flip chip packages having warpage control and methods for fabricating such packages are described. In one embodiment, the flip chip package comprises a package substrate; a chip coupled to the package substrate; and a ring structure coupled to the package substrate and positioned laterally around the periphery of the chip so that a surface of the chip is exposed, wherein the ring structure comprises one or more compressive members, each of the one or more compressive members compressively opposed to a surface of the package substrate to counter or absorb stresses in the package substrate.
Claims20
A semiconductor device package, comprising:
- a package substrate;
- a chip coupled to the package substrate;
- and
- a ring structure coupled to the package substrate and positioned laterally around the periphery of the chip so that a surface of the chip is exposed, wherein the ring structure comprises one or more compressive members, each of the one or more compressive members compressively opposed to a surface of the package substrate to counter or absorb stresses in the package substrate, and the ring structure further comprises one or more clips, each clip having an open end through which a respective corner of the package substrate passes.
A ring structure for use in flip chip packaging having a die coupled to a package substrate, the ring structure comprising:
- a body positioned laterally around the periphery of the die so that the surface of the die is exposed;
- and
- one or more compressive members integral to the body, wherein each of the one or more compressive members compressively are opposed to a surface of the package substrate to counter or absorb stresses in the package substrate, and the ring structure further comprises one or more clips, each clip having an open end through which a respective corner of the package substrate passes.
A method for fabricating a semiconductor package, comprising:
- providing a package substrate;
- coupling a chip to the package substrate;
- and
- coupling a ring structure to the package substrate, the ring structure positioned laterally around the periphery of the chip so that a surface of the chip is exposed, wherein the ring structure comprises one or more compressive members, each of the one or more compressive members compressively opposed to a surface of the package substrate to counter or absorb stresses in the package substrate.
Dependencies are inferred from the claim text.