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US 8,283,776 B2Granted
Microfabricated pillar fins for thermal management
AssigneeQUALCOMM Incorporated
InventorArvind Chandrasekaran
Life of this patent
Estimating the term…
Abstract
An electrical package with improved thermal management. The electrical package includes a die having an exposed back surface. The package further includes a plurality of fins extending outwardly from the back surface for dissipating heat from the package. The die can be arranged in a multi-die stacking configuration. In another embodiment, a method of forming a die for improved thermal management of an electrical package is provided.
Claims20
An electrical package, comprising:
- a die having an outer surface;
- a metallic seed layer disposed on the outer surface;
- and
- a fin integrally formed from the metallic seed layer and extending outwardly therefrom for dissipating heat from the package.
1 more element
An electrical package, comprising:
- a plurality of dies each of which has an outer surface;
- a metallic seed layer disposed on the outer surface of each of the plurality of dies;
- and
- a plurality of fins extending outwardly from the metallic seed layer of at least one die;
- wherein, the plurality of dies are coupled to one another and stacked within the package.
2 more elements
An electrical package, comprising:
- a die having an outer surface;
- a metallic seed layer disposed on the outer surface;
- and
- means for dissipating heat from the die;
- wherein, the means for dissipating is integrally formed from the metallic seed layer.
2 more elements
Dependencies are inferred from the claim text.