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US 8,283,774 B2Granted
Chip on film type semiconductor package
AssigneeMagnaChip Semiconductor, Ltd.
InventorDo-Young Kim
Life of this patent
Estimating the term…
Abstract
A chip on film type semiconductor package includes a film, a plurality of leads formed over the film, a chip formed over the plurality of leads, an under-fill layer filled an space between the chip and the plurality of leads and an insulating heating sheet formed on an opposite side of the film contacting to the plurality of leads, wherein the insulating heating sheet is formed of a compound based on a glass fiber.
Claims8
A chip on film type semiconductor package, comprising:
- a film;
- a plurality of leads formed beneath the film;
- a chip coupled to one ends of the leads;
- an under-fill layer filled between the chip and the plurality of leads;
- and
- an insulating heating sheet formed on over the film and comprising a glass fiber inserted between silicon paste layers, wherein the insulating heating sheet has a thermal resistance less than approximately 0.2° C/W.
3 more elements
Dependencies are inferred from the claim text.