US 8,283,772 B1Granted

Flip-flop semiconductor device packaging using bent leadfingers

AssigneeCypress Semiconductor Corporation

InventorCarlo Gamboa

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Abstract

A semiconductor device package, a method of fabricating a semiconductor device package and a method of testing an integrated circuit utilizing a semiconductor device package are disclosed. Embodiments create a flip-flop semiconductor device package by coupling a semiconductor device, with a wire-bonded arrangement of conductive pads, in a face-up orientation beneath multiple bent leadfingers. The flip-flop package offers improved signaling properties, durability, reliability, and package density at reduced cost given that the conductive pads of the device couple directly to the bent leadfingers, without requiring the manufacture of a new device or the rerouting of signal paths. Additionally, the flip-flop configuration provides convenient means for exposing surfaces of the device (e.g., to increase heat transfer therefrom, thermal performance of the device, etc.) and/or surfaces of the leadfingers (e.g., to provide test points, wire bondouts, etc.).

Claims10

Dependent claims

A semiconductor device package comprising:

a semiconductor device comprising a plurality of conductive pads in a wire-bonded arrangement;
a plurality of bent leadfingers, wherein each bent leadfinger comprises a first surface extending over one of the plurality of conductive pads of said semiconductor device and coupled to the conductive pad of said semiconductor device and a second surface proximal to a bottom surface of said semiconductor device package, wherein said first surface is offset from said second surface by a bend in each of said plurality of bent leadfingers, and said semiconductor device is positioned between said first surface and said second surface in the offset formed by said bend in each of said plurality of bent leadfingers;
a packaging material at least partially encapsulating said semiconductor device and said bend in each of said plurality of bent leadfingers, wherein said plurality of bent leadfingers extend from said packaging material to form pins;
and
wherein each bent leadfinger comprises a thickness that varies from a first thickness at an end extending over said semiconductor device proximal to the first surface to a second thickness at an end proximal to the second surface.

2 more elements

Dependencies are inferred from the claim text.