Semiconductor device and communication method
AssigneeRenesas Electronics Corporation
InventorsYasutaka Nakashiba, Kenta Ogawa
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Abstract
A semiconductor module includes a semiconductor device including a mounting board, a semiconductor chip disposed at a first surface of the mounting board, a first inductor which is provided at a surface side of the semiconductor chip not facing the mounting board in order to perform communication between the semiconductor chip and the outside, a sealing resin layer which is formed at the first surface of the mounting board in order to seal the semiconductor chip, and a recess or an opening which is provided in the sealing resin layer and which includes the inductor inside when seen in a plan view; and a second inductor, which is located in the recess or the opening of the semiconductor device so that the second inductor performs communication with the first inductor.
Claims8
A semiconductor module comprising:
- a semiconductor device including a mounting board a semiconductor chip disposed at a first surface of said mounting board, a first inductor which is provided at a surface side of said semiconductor chip not facing said mounting board in order to perform communication between said semiconductor chip and the outside, a sealing resin layer which is formed at said first surface of said mounting board in order to seal said semiconductor chip, and a recess or an opening which is provided in said sealing resin layer and which includes said inductor inside when seen in a plan view;
- and
- a second inductor, which is located in said recess or said opening of said semiconductor device so that said second inductor performs communication with said first inductor.
Dependencies are inferred from the claim text.