Modular low stress package technology
AssigneeSTMicroelectronics S.r.l.
InventorsCraig J. Rotay, John Ni, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross
Life of this patent
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AssigneeSTMicroelectronics S.r.l.
InventorsCraig J. Rotay, John Ni, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross
Estimating the term…
A protective modular package cover has first and second fastening sections located at opposing first and second ends with one or more subassembly receiving sections disposed thereto and is configured to fasten the protective modular package cover to a core. Each fastening section has a foot surface located on a bottom surface of a fastening section and configured to make contact with the core, a mounting hole configured to receive a fastener, and a torque element. Each subassembly receiving section is configured to receive a subassembly and has a cross member formed along the underside of the protective modular package cover. Activation of the first torque element transfers a downward clamping force generated at the fastening element to a top surface of one or more subassemblies disposed in the one or more subassembly receiving sections via the cross member of each of the one or more subassembly receiving sections.
A protective modular package cover, comprising:
Dependencies are inferred from the claim text.