Microelectronic assembly with an embedded waveguide adapter and method for forming the same

A microelectronic assembly, comprising:

• first and second semiconductor substrates, each semiconductor substrate having first and second portions and first and second opposing sides;
• a first tuning depression on the second opposing side and the second portion of the first semiconductor substrate;
• a radio frequency conductor on the first opposing side of the first semiconductor substrate, the radio frequency conductor having a first end on the first portion of the first semiconductor substrate and a second end on the second portion of the first semiconductor substrate;
• a microelectronic die having an integrated circuit formed therein attached to the first opposing side and the first portion of the first semiconductor substrate such that the integrated circuit is electrically connected to the first end of the radio frequency conductor;
• a second tuning depression on the second opposing side and the second portion of the second semiconductor substrate;
• and
• a die depression on the second opposing side and the first portion of the second semiconductor substrate;
• wherein the second semiconductor substrate is attached to the first semiconductor substrate such that the first opposing side of the first semiconductor substrate is adjacent to the second opposing side of the second semiconductor substrate, the microelectronic die is at least partially positioned within the die depression, and the second end of the radio frequency conductor is positioned between the first and second tuning depressions.

A microelectronic assembly, comprising:

• a semiconductor substrate having first and second opposing sides and comprising a plurality of package portions, each of the plurality of package portions having a first and a second portion;
• a plurality of tuning depressions formed on the second opposing side of the semiconductor substrate, each of the plurality of tuning depressions being on the second portion of a respective one of the package portions;
• a plurality of radio frequency conductors formed on the first opposing side of the semiconductor substrate, each of the plurality of radio frequency conductors having a first end on the first portion of a respective one of the package portions and a second end on the second portion of the respective one of the package portions;
• and
• a microelectronic die having an integrated circuit formed therein attached to the first portion of each of the package portions of the semiconductor substrate such that the integrated circuit is electrically connected to the first end of the radio frequency conductor on the respective package portion.