Power semiconductor module and fabrication method thereof
AssigneeHitachi, Ltd.
InventorsKazuhiro Oyama, Mutsuhiro Mori, Katsuaki Saito, Yoshihiko Koike
Life of this patent
Estimating the term…
Abstract
An elastic printed board is provided so that stress applied by the silicon gel is absorbed by the printed board. Further, the printed board is formed to be so narrow that the stress may be escaped. On the other hand, the wires on which a high voltage is applied are patterned on respective printed boards. This serves to prevent discharge through the surface of the same printed board served as current passage. This design makes it possible to hermetically close the power module, prevent intrusion of moisture or contamination as well as displacement, transformation and crack of the cover plate.
Claims19
A power semiconductor module comprising:
- a power circuit portion having a power semiconductor chip located on an upper surface of a base having a case on an outer periphery of the base;
- a printed board with a circuit component mounted thereon, located above the power circuit portion with a space therebetween;
- supporters which couple supporting portions of the printed board with a cover plate located on an upper portion of the case, said supporters extending from said cover plate;
- and
- silicone gel which is filled in the semiconductor module, wherein the printed board is sunk in the silicone gel so that the silicone gel is located at least under the printed board so that the printed board is transformable between the supporting portions according to a volume expansion of the silicone gel to be deformed between the supporting portions so that a stress applied from the silicone gel is absorbed by the printed board.
A power semiconductor module comprising:
- a power circuit portion having a power semiconductor chip located on an upper surface of a base having a case on an outer periphery of the base;
- a printed board with a circuit component mounted thereon, located above the power circuit portion with a space therebetween;
- silicone gel which is filled in the semiconductor module, wherein the printed board is sunk in the silicone gel so that the silicone gel is located at least under the printed board;
- and
- means for absorbing stress applied from the silicone gel to the printed board by permitting the printed board to be deformable in response to volume expansion of the silicone gel, said stress absorbing means including supporting means, coupled between the printed board and supporting portions of the printed board, said supporting portions being located so that said printed board is transformable and deformable between said supporting portions when said stress is applied.
Dependencies are inferred from the claim text.