Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
AssigneeMicron Technology, Inc.
InventorsTeck Kheng Lee, Voon Siong Chin, Ai Chie Wang
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Abstract
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side.
Claims21
A leadframe for a microelectronic device, comprising:
- a die paddle disposed longitudinally between first and second ends of the leadframe and disposed latitudinally between first and second sides of the leadframe;
- a first lead defining a first portion of the die paddle and extending between the first and second ends of the leadframe;
- and
- a second lead defining a second portion of the die paddle and carried by the first end of the leadframe and one of the first second and the second sides of the leadframe, wherein at least one of the first and the second leads are current carrying leads.
A leadframe for a microelectronic device, comprising:
- a die paddle disposed longitudinally between first and second ends of the leadframe and disposed latitudinally between first and second sides of the leadframe;
- a first lead defining a first portion of the die paddle and extending generally longitudinally between the first and second ends of the leadframe;
- a second lead defining a second portion of the die paddle and having a first section and a second section, the first section of the second lead extending generally longitudinally between the first and the second ends, and the second section of the second lead extending generally laterally between the first side and the first section of the second lead;
- and
- a third lead defining a third portion of the die paddle and having a first section and a second section, the first section of the third lead extending generally longitudinally from the first end, and the second section of the third lead extending generally laterally between the second side and the first section of the third lead, wherein at least one of the first, second and third leads are current carrying leads.
A method of manufacturing a leadframe for a microelectronic device, the leadframe extending longitudinally between first and second ends and latitudinally between first and second sides, comprising:
- forming a first lead extending generally longitudinally between the first and second ends of the leadframe;
- forming a second lead including—
- forming a first section of the second lead, the first section of the second lead extending generally longitudinally between the first and the second ends of the leadframe;
- and
- forming a second section of the second lead, the second section of the second lead extending laterally between the first side of the leadframe and the first section of the second lead;
- and
- forming a third lead including—
- forming a first section of the third lead, the first section of the third lead extending generally longitudinally from the second end of the leadframe;
- and
- forming a second section of the third lead, the second section of the third lead extending laterally between the second side of the leadframe and the first section of the third lead, wherein at least one of the first, second and third leads are current carrying leads.
A method of manufacturing a leadframe for a microelectronic device, the leadframe extending longitudinally between first and second ends and latitudinally between first and second sides, comprising:
- forming a first dambar proximate to the first end;
- forming a second dambar proximate to the second end, the second dambar being spaced a first distance from the first dambar;
- forming a first tie-bar connecting the first and second dambars;
- forming a second tie-bar connecting the first and second dambars, the second tie-bar being spaced a second distance from the first tie-bar;
- and
- forming a plurality of leads, including—
- forming a first lead extending generally longitudinally from the first dambar to the second dambar;
- and
- forming a second lead extending longitudinally between the first and the second dambars to a first intermediate location and laterally between the first tie-bar and the first intermediate;
- location, wherein at least one of the first and the second leads are current carrying leads.
Dependencies are inferred from the claim text.