Lead frame interconnect scheme with high power density
AssigneeNational Semiconductor Corporation
InventorsKen Pham, Anindya Poddar, Ashok S. Prabhu
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Abstract
An integrated circuit package configured to incorporate a lead frame and methods for its making are is described. The package comprising an IC with aluminum bond pads in communication with circuitry of the die with lead frame with silver bond pads. The package having gold bumps bonded between the aluminum bond pad of the die and the silver bond pad of the lead frame. The package including an encapsulant envelope and including various materials and bond pad structures and constructed in a manner formed by thermosonically or thermocompressionally bonding the gold balls to the bond pads. Also, disclosed are methods of making the package.
Claims11
An integrated circuit package comprising;
- an integrated circuit die having an aluminum bond pad in communication with circuitry of the die;
- a conductive lead frame having a silver bond pad;
- a gold bump connecting the aluminum bond pad and the silver bond pad;
- wherein the aluminum bond pad has a support strong enough to prevent damage to the die during the lead frame attachment process;
- and
- an encapsulant envelope that encases at least a portion of the conductive lead frame and at least a portion of the die.
Dependencies are inferred from the claim text.