Quad flat package with exposed common electrode bars

An electronic package, comprising:

• a die pad;
• a die attached to the die pad;
• a plurality of leads surrounding the die pad and spaced therefrom to define a ring gap therebetween, wherein the plurality of leads are not coplanar to the die pad;
• at least one first common electrode bar in the ring gap and substantially coplanar to the die pad, wherein at least two of the plurality of leads extend to the first common electrode bar;
• and
• a molding compound partially encapsulating the die pad and the first common electrode bar, such that the bottom surfaces of the die pad and the first common electrode bar are exposed.

An electronic device, comprising:

• an electronic package, comprising:
• a die pad;
• a die attached to the die pad;
• a plurality of leads surrounding the die pad and spaced therefrom to define a ring gap therebetween, wherein the plurality of leads are not coplanar to the die pad;
• at least one common electrode bar in the ring gap and substantially coplanar to the die pad, wherein at least two of the plurality of leads extend to the common electrode bar;
• and
• a molding compound partially encapsulating the die pad and the common electrode bar, such that an outer end of each lead and the bottom surfaces of the die pad and the common electrode bar are exposed;
• and
• a circuit board bonded to the electronic package.