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US 8,283,752 B2Granted
Semiconductor device
AssigneeRenesas Electronics Corporation
InventorYasutaka Nakashiba
Life of this patent
Estimating the term…
Abstract
In a semiconductor device, a first semiconductor chip includes a first circuit and a first inductor, and a second semiconductor chip includes a second circuit and chip-side connecting terminals. An interconnect substrate is placed over the first semiconductor chip and the second semiconductor chip. The interconnect substrate includes a second inductor and substrate-side connecting terminals. The second inductor is located above the first inductor. The chip-side connecting terminals and the two substrate-side connecting terminals are connected through first solder balls.
Claims9
A semiconductor device comprising:
- one or two semiconductor chips that include an interconnect layer;
- and
- an interconnect substrate attached to an interconnect layer side of said one or two semiconductor chips,
- wherein said one or two semiconductor chips includes:
- a first circuit that generates a signal;
- a second circuit that processes said signal;
- a first inductor that is formed in said interconnect layer, and is connected to one of said first circuit and said second circuit;
- a chip-side connecting terminal that is formed in an uppermost layer of said interconnect layer, and is connected to the other one of said first circuit and said second circuit,
- said interconnect substrate includes:
- a second inductor that is located above said first inductor;
- and
- a substrate-side connecting terminal that is connected to said second inductor, and is located above said chip-side connecting terminal,
- said chip-side connecting terminal and said substrate-side connecting terminal are connected through a first solder ball or a first bump.
10 more elements
Dependencies are inferred from the claim text.