Semiconductor device including sensor member and cap member and method of making the same
AssigneeDenso Corporation
InventorsTetsuo Fujii, Masaki Inoue
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a sensor member and a cap member. The sensor member has a surface and includes a first sensing section. The first sensing section includes first and second portions that are located on the surface side of the sensor member and electrically insulated from each other. The cap member has a surface and includes a cross wiring portion. The surface of the cap member is joined to the surface of the sensor member in such a manner that the first sensing section is sealed by the sensor member and the cap member. The cross wiring portion electrically connects the first portion to the second portion.
Claims16
A semiconductor device comprising:
- a sensor member having a surface and including a first sensing section, the first sensing section including first and second portions located on the surface side of the sensor member and electrically insulated from each other;
- and
- a cap member having a first surface joined to the surface of the sensor member in such a manner that the first sensing section is sealed by the sensor member and the cap member, the cap member including a cross wiring portion for electrically connecting the first portion to the second portion, wherein
- the cap member has a second surface opposite to the first surface,
- the cross wiring portion includes a cross wire, a first through electrode, and a second through electrode,
- the cross wire is located on the second surface of the cap member and extends parallel to the second surface of the cap member,
- the first through electrode extends from the first surface to the second surface of the cap member and has a first end electrically connected to the cross wire and a second end electrically connected to the first portion,
- the second through electrode extends from the first surface to the second surface of the cap member and has a first end electrically connected to the cross wire and a second end electrically connected to the second portion, and
- the cap member further has a bonding pad located on the second surface of the cap member and electrically connected to the cross wire.
A method of making a semiconductor device comprising:
- preparing a sensor member having a surface and including a first sensing section, the first sensing section having a first portion located on the surface side of the sensor member and a second portion electrically insulated from the first portion;
- preparing a cap member having a first surface and a second surface opposite to the first surface;
- joining the surface of the sensor member to the first surface of the cap member in such a manner that the first sensing section is sealed by the sensor member and the cap member;
- forming a cross wiring portion for electrically connecting the first portion to the second portion;
- and
- forming a bonding pad on the second surface of the cap member, wherein
- the forming of the cross wiring portion includes forming a first through electrode, forming a second through electrode, and forming a cross wire,
- the first through electrode penetrates the cap member from the first surface to the second surface and has a first end electrically connected to the first portion,
- the second through electrode penetrates the cap member from the first surface to the second surface and has a first end electrically connected to the second portion,
- the cross wire is located on the second surface and electrically connects a second end of the first through electrode to a second end of the second through electrode, and
- the bonding pad is electrically connected to the cross wire.
Dependencies are inferred from the claim text.