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US 8,283,737 B2Granted
MEMS package and method of manufacturing the MEMS package
AssigneeKabushiki Kaisha Toshiba
InventorYoshiaki Sugizaki
Life of this patent
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Abstract
An MEMS chip is mounted face-down on a semiconductor wafer such that a movable section is opposed to the semiconductor wafer. A resin layer is formed on the semiconductor wafer around the MEMS chip to reduce a step between the MEMS chip and the semiconductor wafer. After the semiconductor substrate is removed, the land electrode is formed on the resin layer.
Claims9
An MEMS package, comprising:
- a semiconductor chip on which a semiconductor element and a first pad electrode are formed;
- a movable section formed above an insulating layer;
- a first resin layer formed on the insulating layer so as to seal the movable section;
- first and second electrodes electrically connected to the movable section formed above the insulating layer;
- a first protruding electrode formed on the first electrode, the first protruding electrode connecting the first pad electrode and the first electrode;
- and
- a first land electrode connected to a rear surface of the second electrode via a first opening formed in the insulating layer.
4 more elements
Dependencies are inferred from the claim text.