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US 8,283,693 B2Granted
Light emitting device with a lens of silicone
AssigneeSeoul Semiconductor Co., Ltd.
InventorsChung Hoon Lee, Do Hyung Kim
Life of this patent
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Abstract
Disclosed herein is a light emitting device with a silicone lens. The light emitting device comprises a heat sink. A package body surrounds at least a portion of the heat sink, and a light emitting diode is mounted on the heat sink. Meanwhile, the light emitting diode is covered with a silicone lens molded on the package body. The molded silicone lens can be employed to prevent reduction in light extraction efficiency due to poor bonding between lens and encapsulant.
Claims15
A light emitting device, comprising:
- a heat sink;
- a package body surrounding at least a portion of the heat sink;
- a light emitting diode mounted on the heat sink such that a top surface of the light emitting diode is positioned at least above a top surface of the package body;
- a silicone lens molded on the package body to cover the light emitting diode;
- and
- a first lead electrode and a second lead electrode embedded in and extending outside of the package body,
- wherein a bottom surface of the silicone lens is below the top surface of the package body,
- wherein the package body comprises insert molded resin and an air discharge port,
- wherein the heat sink is disposed in a support ring, and the heat sink and the support ring contact the package body,
- wherein the support ring comprises a first ring connecting portion and a second ring connecting portion,
- wherein the first and second ring connecting portions are formed in the package body and extend to an outside surface of the package body,
- wherein the silicone lens comprises a protrusion, and the silicone lens protrusion fills the discharge port, and
- wherein the protrusion is arranged directly on the first and second ring connecting portions.
10 more elements
Dependencies are inferred from the claim text.