Surface mounted LED package
AssigneeLite-On Technology Corporation
InventorsChih-Lung Liang, Yuan-Fu Chen
Life of this patent
Estimating the term…
Abstract
An LED device and LED module are provided. The LED device is coupled to a lead frame with a first plane and a second plane opposite to the first plane, the lead frame having a LED chip disposed on the first plane. The LED device includes a reflection cup structure disposed on the lead frame, a lens structure and at least one fixing structure. The LED chip is disposed in the reflection cup structure and electrically connected to the first plane of the lead frame. The lens structure covers the first plane and the second plane of the lead frame. The fixing structure and the fixing structures are formed integrally and cover the lead frame cooperatively.
Claims11
An LED module comprising:
- a lead frame having a first plane, a second plane opposite to the first plane, and at least one through structure patterned on the lead frame for defining a plurality pairs of separated electrodes thereof;
- a plurality of reflection cup structures disposed on the lead frame and protrudingly exposed from the first and the second planes thereof, each of the reflection cup structures being spaced at predetermined intervals from each other and corresponding to the electrodes, wherein a connecting portion of the lead frame is defined between each pair of adjacent reflection cup structures;
- a plurality of LED chips, each of which being respectively disposed in one of the reflection cup structures and electrically connected to the lead frame;
- and
- a lens member made of a thermoplastic transparent material coveringly disposed on the lead frame that encapsulates the reflective cup structures from both the first and the second planes, the lens member comprising a plurality of integrally formed lens structures and fixing structures,
- wherein the lens structures are correspondingly formed above each of the LED chips;
- and
- wherein the fixing structures respectively and continuously encapsulate the lead frame from both the first and second planes of the connection portion, thereby fixing the lens member on the lead frame.
An LED module comprising:
- a lead frame having a first plane, a second plane opposite to the first plane, and at least one through structure patterned on the lead frame for defining a plurality pairs of separated electrodes thereof;
- a reflection cup member encapsulatingly disposed on the lead frame and selectively covering the first and the second planes thereof, the reflection cup member comprising
- a plurality of reflection cup structures arranged on the lead frame and protrudingly exposed from the first and the second planes thereof, each of the reflection cup structures being spaced at predetermined intervals from each other, and
- a plurality of runners respectively formed at two sides of each of the reflection cup structures and penetrating the reflection cup member,
- wherein a connecting portion of the lead frame is defined between each pair of adjacent cup structures;
- wherein a plurality of second fixing structures are formed by portions of the reflection cup member between each pair of adjacent cup structures on the second plane of the connecting portion;
- a plurality of LED chips, each of which being respectively disposed in one of the reflection cup structures and electrically connected to the lead frame;
- and
- a plurality of lens structures formed above the plurality of LED chips respectively, each lens structure comprising a plurality of integrally formed first fixing structures extending through the runners at two sides of each reflection cup structure,
- wherein the first fixing structures fixedly retain the lens structures on the reflection cup member;
- and
- wherein each of the second fixing structures correspondingly continuously encapsulates the second plane of each connection portion to retain the reflection cup member fixedly to the lead frame.
Dependencies are inferred from the claim text.