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US 8,283,683 B2Granted
Chip-bonding light emitting diode chip
AssigneeOpto Tech Corporation
InventorsChang-Da Tsai, Wei-Che Wu, Chia-Liang Hsu, Ching-Shih Ma
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Abstract
A light emitting diode chip includes a permanent substrate having a holding space formed on the permanent substrate; an insulating layer and a metal layer sequentially formed on the permanent substrate and the holding spacer; a die having a eutectic layer and a light-emitting region and bonded to the metal layer within the holding space via the eutectic layer coupling to the metal layer; a filler structure filled between the holding space and the die; and an electrode formed on the die and in contact with the light-emitting region.
Claims10
A LED chip, comprising:
- a permanent substrate having a holding space on top of the permanent substrate;
- an insulating layer on top of the permanent substrate and covering the holding space;
- a first metal layer on top of the insulating layer;
- a second metal layer on top the insulating layer;
- a die comprising a eutectic layer and a light-emitting region, wherein the light-emitting region is on top of the eutectic layer, and the die is bonded to the first metal layer within the holding space via the eutectic layer coupling to the first metal layer;
- a filler structure filled between the die and the holding space;
- and
- a first electrode on top of the die, in contact with the light-emitting region and above the filler structure, and above and contacting the second metal layer, and the first electrode extending to outside of the holding space;
- wherein a portion of a surface of the light-emitting region is exposed from the filler structure and the first electrode, and the second metal layer is formed between the first electrode and the insulating layer.
6 more elements
A LED chip, comprising:
- a permanent substrate having a holding space on top of the permanent substrate;
- an insulating layer, on top of the permanent substrate covering, including a first insulating layer section covering the holding space and a second insulating layer section covering the permanent substrate outside of the holding space, wherein the first insulating layer section is connected with the second insulating layer section;
- a first metal layer on top of the insulating layer;
- a die comprising a eutectic layer and a light-emitting region, wherein the light-emitting region is on top of the eutectic layer, and the die is bonded to the first metal layer within the holding space via the eutectic layer coupling to the first metal layer;
- a filler structure filled between the die and the holding space;
- and
- a first electrode on top of the die, in contact with the light-emitting region, and the first electrode horizontally extending to directly above the second insulating layer section and to outside the holding space;
- wherein the first electrode is not in contact with the first metal layer;
- and
- wherein a portion of a surface of the light-emitting region is exposed from the filler structure and the first electrode.
7 more elements
Dependencies are inferred from the claim text.