Bonding apparatus and method of metal plate
AssigneesSungwoo Hitech Co., Ltd., Pukyong National University Business Incubator Center
InventorIn Tai Jin
Life of this patent
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Abstract
A bonding apparatus of metal plates includes an upper mold having a first guide pathway formed vertically inside thereof; a middle mold having a second guide pathway formed vertically inside thereof, where the middle mold is disposed under the upper mold; a lower mold having a metal removing pathway formed vertically inside thereof, where the lower mold is disposed under the middle mold; a heating unit for heating the metal plates and a metal tape; a punch for applying a bonding load to the metal plates; a clamping unit that applies a clamping load for clamping the metal plates to the upper mold; and a bonding unit that applies the bonding load to the punch for bonding the metal plates.
Claims24
A bonding apparatus of metal plates, comprising:
- metal plates that are overlapped each other;
- a metal tape used for bonding the overlapped metal plates, and material thereof being the same as material of the metal plates;
- a metal tape transfer unit for supplying and withdrawing the metal tape;
- a rivet member punched from the metal tape and heated;
- an upper mold for clamping the metal tape by an elastic force of a coil spring that is mounted on an upper portion thereof, the upper mold guiding a punch and used as a first electrode;
- a middle mold for clamping the overlapped metal plates and punching the metal tape in order to make the rivet member, the middle mold guiding the rivet member and the punch, and used as a second electrode;
- a lower mold for supporting the overlapped metal plates, the lower mold being used as an extrusion die for extruding the metal plates by the rivet member, a shaving mold for shaving excess metal during extrusion, and a third electrode;
- and
- the punch for making the rivet member by punching the metal tape, the punch press-fitting the rivet member to the overlapped metal plates by applying a load to the rivet member.
A bonding apparatus of metal plates, comprising:
- an upper mold having a first guide pathway formed vertically inside thereof;
- a middle mold having a second guide pathway formed vertically inside thereof, the middle mold being disposed under the upper mold;
- a lower mold having a metal removing pathway formed vertically inside thereof, the lower mold being disposed under the middle mold;
- a heating unit for heating the metal plates and a metal tape;
- a punch for applying a bonding load to the metal plates;
- a clamping unit that applies a clamping load for clamping the metal plates to the upper mold
- a bonding unit that applies the bonding load for bonding the metal plates to the punch;
- and
- a lower mold transfer unit that moves the lower mold in a horizontal direction.
A bonding method of metal plates, comprising:
- clamping the overlapped metal plates with a lower mold and a middle mold;
- disposing a metal tape over the overlapped metal plates by the middle mold and an upper mold;
- heating the overlapped metal plates and the metal tape with a heating unit;
- making a rivet member by punching the metal tape;
- and
- press-fitting the rivet member into the overlapped metal plates with a punch;
- and
- removing excess metal that is pushed out during press-fitting,
- wherein the excess metal is removed and the metal plates are shaved by moving the lower mold in a horizontal direction, coincidentally.
Dependencies are inferred from the claim text.