Electrical device, system and method for operating with reduced acoustic noise generation

An electrical system configured to operate with reduced acoustic noise generation, the system comprising:

• a first stiffening component having a stiffening portion secured to a securing portion,
• a semiconductor device having first and second sides with first and second end faces, respectively,
• wherein the first end face is a substantially planar end face, and wherein the first side also includes a flange portion that is situated about a perimeter of the first end face,
• wherein the first stiffening component is secured to the flange portion of the semiconductor device, thereby providing additional rigidity to the flange portion, and
• wherein a second stiffening component is secured to the second side and each end face is configured to be in contact with at least one heat sink.

An electrical system configured for operating with reduced acoustic noise generation, the system comprising:

• a stiffening component having a stiffening portion secured to a securing portion,
• a semiconductor device having at least one substantially planar end face with a flange portion situated about a perimeter of the end face, wherein the stiffening component is secured to the semiconductor device to provide additional rigidity to the flange portion,
• wherein the semiconductor device is at least one of an insulated gate bipolar transistor (IGBT), a symmetrical gate commutated thyristor (SGCT), an integrated gate commutated thyristor (IGCT), a silicon-controlled rectifier (SCR), or another press-pack semiconductor device;
• and
• wherein the flange portion of the semiconductor device includes a substantially planar flange face, the flange face being substantially parallel to the end face, wherein the stiffening component is secured to the flange face of the semiconductor device such that it does not extend into a plane of the end face.