Semiconductor assembly and multilayer wiring board
AssigneePanasonic Corporation
InventorsYoshihiro Tomura, Shigeru Kondou, Teppei Iwase
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Abstract
A semiconductor assembly includes a multilayer wiring board including at least three insulating layers, first, second and third insulating layers and a semiconductor device attached to one principal surface of the first insulating layer. The first, second and third insulating layers are stacked in this order. The multilayer wiring board further includes a heat-insulating member made of a material having a lower thermal conductivity than the insulating layers. The heat-insulating member is disposed between the first and second insulating layers or next to the first insulating layer at a side opposite to the one principal surface.
Claims12
A semiconductor assembly comprising:
- a multilayer wiring board including at least three insulating layers including first, second and third insulating layers;
- and
- a semiconductor device attached to one principal surface of the first insulating layer of the multilayer wiring board, wherein:
- the first, second and third insulating layers are stacked in this order,
- the multilayer wiring board further includes a heat-insulating member made of a material having a lower thermal conductivity than the insulating layers, and
- the heat-insulating member is disposed between the first and second insulating layers or disposed in the second insulating layer.
Dependencies are inferred from the claim text.