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US 8,283,566 B2Granted
Printed circuit boards by massive parallel assembly
AssigneePalo Alto Research Center Incorporated
InventorsJengPing Lu, Eugene M. Chow
Life of this patent
Estimating the term…
Abstract
A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern. A circuit substrate, has a desired circuit pattern on a substrate, the substrate made up of at least two unit cells having conductive lines electrically connected together.
Claims7
A circuit substrate, comprising:
- a desired circuit pattern on a substrate, the substrate made up of at least two unit cells having conductive lines on a face of the unit cells, such that the conductive line on the face of one unit cell contacts electrically the conductive line on the face of the other unit cell;
- each unit cell being of a material bondable to the other unit cell, the material having the characteristic of fusing to the other unit cell when heated to form the substrate.
A circuit substrate, comprising:
- a desired circuit pattern on a substrate, the substrate made up of at least two unit cells having conductive lines on a face of the unit cells, such that the conductive line on the face of one unit cell contacts electrically the conductive line on the face of the other unit cell;
- each unit cell being of a material bondable to the other unit cell, the material having the characteristic of expanding and coming into contact to the other unit cell when heated to form the substrate.
Dependencies are inferred from the claim text.