US 8,283,208 B2 · Method and apparatus for fabricating integrated circuit device using self-organizing function

Abstract

In a method of fabricating an integrated circuit device having a three-dimensional stacked structured, the step of fixing many chip-shaped semiconductor circuits to a support substrate or a circuit layer with a predetermined layout can be performed easily and efficiently with a desired accuracy. Temporary adhesion portions 12b of semiconductor chips 13 are temporarily adhered to corresponding temporary adhesion regions 72a of a carrier substrate 73a by way of water films 81. The carrier substrate 73a is then pressed toward a support substrate or a desired circuit layer, thereby contacting connecting portions 12 of the chips 13 on the carrier substrate 73a with corresponding predetermined positions on the support substrate or a circuit layer. Thereafter, by fixing the connecting portions 12 to the predetermined positions, the chips 13 are attached to the support substrate or the circuit layer with a desired layout.

A method of fabricating an integrated circuit device having a three-dimensional stacked structure formed by stacking circuit layers on a support substrate, the method comprising the steps of:

(a) when fixing chip-shaped semiconductor circuits included in one of the circuit layers on a mounting surface of the support substrate, or other of the circuit layers that is adjacent to the one of the circuit layers to have a desired layout,
(i) forming one or more temporary adhesion regions on a surface of a support member for transfer;
(ii) forming a temporary adhesion portion that can be temporarily adhered to the one or more temporary adhesion regions, at an opposite end of each of the chip-shaped semiconductor circuits to a connecting portion thereof;
(iii) collectively placing the chip-shaped semiconductor circuits at the same time as one lump on the support member so as to have a layout equivalent to a mirror image of the desired layout by temporarily adhering the temporary adhesion portion of each of the chip-shaped semiconductor circuits to the one or more temporary adhesion regions, wherein the semiconductor circuits are temporarily adhered to the one or more temporary adhesion regions of the support member for transfer using an absorption force of a liquid, and when the temporary adhesion portions of the semiconductor circuits are temporarily adhered to the one or more temporary adhesion regions, the semiconductor circuits are self-aligned in position by surface tension of the liquid;
(iv) bringing collectively the temporary adhesion portions of the chip-shaped semiconductor circuits into contact with the mounting surface at corresponding predetermined positions of the mounting surface by causing the support member on which the chip-shaped semiconductor circuits have been placed to approach the mounting surface of the support substrate or the other of the circuit layers;
and
(v) disposing the chip-shaped semiconductor circuits on the mounting surface to have the desired layout by fixing the connecting portions of the chip-shaped semiconductor circuits to the corresponding predetermined positions of the mounting surface that have been brought into contact with each other;
and
(b) detaching the support member from the temporary adhesion portions of the chip-shaped semiconductor circuits by separating the support member from the support substrate or the other of the circuit layers, wherein
the total number of the temporary adhesion regions of the support member for transfer is equal to that of the semiconductor circuits, and the semiconductor circuits and the temporary adhesion regions are in a one-to-one correspondence, and
wherein the semiconductor circuits are temporarily adhered to the temporary adhesion regions through the steps of
(A) forming films of the liquid on at least one of the opposite ends of the semiconductor circuits to the connecting portions and the one or more temporary adhesion regions corresponding to the at least one of the opposite ends;
(B) respectively linking the opposite ends of the semiconductor circuits with the corresponding one or more temporary adhesion regions in an opposed state thereof using the films of the liquid;
and
(C) respectively bringing the opposite ends into contact with the corresponding one or more temporary adhesion regions by applying a pressing force to between the opposite ends and the corresponding one or more temporary adhesion regions, thereby temporarily adhering the semiconductor circuits to the corresponding temporary adhesion regions in a detachable manner.

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Method and apparatus for fabricating integrated circuit device using self-organizing function

Life of this patent

Method and apparatus for fabricating integrated circuit device using self-organizing function

Life of this patent

Abstract

Claims38