Method of forming pattern and method of producing solid-state image pickup device
AssigneeCanon Kabushiki Kaisha
InventorKyouhei Watanabe
Life of this patent
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Abstract
Provided is a method of forming a pattern including the steps of forming a first pattern including a depressed or protruding alignment mark on a substrate; forming a flattening layer on the first pattern; removing a part of the flatting layer above the alignment mark; forming a processed layer on the flattening layer to cover the alignment mark; performing alignment by optically detecting a position of the alignment mark from above the processed layer, using light; and forming a second pattern by patterning the processed layer on the basis of the alignment.
Claims11
A method of forming a pattern comprising:
- forming a first pattern including a depressed or protruding alignment mark above a substrate;
- forming a flattening layer on the first pattern;
- removing a part of the flatting layer above the alignment mark;
- forming a processed layer on the flattening layer to cover the alignment mark;
- performing alignment by optically detecting a position of the alignment mark from above the processed layer, using light;
- and
- forming a second pattern by patterning the processed layer based on the alignment.
A method of producing a solid-state image pickup device comprising:
- forming a wiring layer including a depressed or protruding alignment mark above a substrate including a photoelectric conversion unit;
- forming a flattening layer on the wiring layer;
- removing a part of the flattening layer above the alignment mark in the wiring layer;
- forming a blue resist layer on the flattening layer with the part removed;
- performing alignment by optically detecting the position of the alignment mark from above the blue resist layer, using light;
- forming a blue color filter by patterning the blue resist layer on the basis of the alignment;
- removing a part of the blue resist layer above the alignment mark;
- forming a microlens layer above the alignment mark after removing a part of the blue resist layer;
- performing alignment by optically detecting the position of the alignment mark from above the microlens layer, using light;
- and
- forming a microlens by patterning or exposing the microlens layer on the basis of the alignment.
Dependencies are inferred from the claim text.