Method for fabricating an image sensor device
AssigneeVisEra Technologies Company Limited
InventorsMing-Sheng Yang, Ya-Yun Yu
Life of this patent
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Abstract
A method for fabricating an image sensor device is disclosed. The method for fabricating an image sensor device comprises forming a photosensitive layer on a substrate. The photosensitive layer is exposed through a first photomask to form an exposed portion and an unexposed portion. The unexposed portion is partially exposed through a second photomask to form a trimmed part, wherein the second photomask comprise a first segment and a second segment that has a transmittance greater than that of the first segment. The trimmed part is removed to form photosensitive structures. The photosensitive structures are reflowed to form a first microlens and a second microlens having different heights.
Claims18
A method for fabricating an image sensor device, comprising:
- forming a photosensitive layer on a substrate;
- exposing the photosensitive layer through a first photomask to form an exposed portion and an unexposed portion;
- partially exposing the unexposed portion through a second photomask to form a trimmed part, wherein the second photomask comprise a first segment and a second segment that has a transmittance greater than that of the first segment, wherein the first segment is opaque and the second segment is semi-transparent;
- removing the trimmed part to form photosensitive structures;
- and
- reflowing the photosensitive structures to form a first microlens and a second microlens having different heights.
Dependencies are inferred from the claim text.