Semiconductor device fabrication method and pattern formation mold
AssigneeKabushiki Kaisha Toshiba
InventorsIkuo Yoneda, Shunko Magoshi
Life of this patent
Estimating the term…
Abstract
According to the present invention, there is provided a semiconductor device fabrication method comprising, bringing a mold having a predetermined pattern into contact with at least a portion of an imprinting material formed on a substrate to be processed, and forming the pattern on the substrate to be processed by sequentially transferring the pattern for each shot, wherein one of a dicing region and a monitor pattern formation region of the substrate to be processed is coated with the imprinting material.
Claims9
A semiconductor device fabrication method comprising:
- bringing a mold having a predetermined pattern into contact with at least a portion of an imprinting material formed on a substrate to be processed;
- and forming the pattern on the substrate to be processed by sequentially transferring the pattern for each shot, wherein one of a dicing region and a monitor pattern formation region of the substrate to be processed is coated with the imprinting material, the mold has a square shape and has one surface on which a pattern region having the pattern and a peripheral region surrounding the pattern region are formed, the peripheral region has a first region having a height equal to a maximum height of the pattern region, and a second region lower than the first region, the second region is formed into an L-shape in at least one corner of the square, and the first region is formed into an L-shape in at least another corner diametrically opposite to the corner where the second region is formed;
- wherein said L-shape is formed in the imprinted material so as to be visible in the plan view of said imprinted material, and the mold is placed such that in the two adjacent shots, the first region of one shot overlaps the second region of the other shot.
A semiconductor device fabrication method comprising:
- bringing a mold having a predetermined pattern into contact with an imprinting material on a substrate to be processed for each shot;
- and forming the pattern on the substrate to be processed by sequentially transferring the pattern, wherein the mold is placed such that at least portions of two adjacent shot regions of the shots overlap each other when forming the pattern, the mold has a square shape and has one surface on which a pattern region having the pattern and a peripheral region surrounding the pattern region are formed, the peripheral region has a first region having a height equal to a maximum height of the pattern region, and a second region lower than the first region, the second region is formed into an L-shape in at least one corner of the square, and the first region is formed into an L-shape in at least another corner diametrically opposite to the corner where the second region is formed;
- wherein said L-shape is formed in the imprinted material so as to be visible in the plan view of said imprinted material, and the mold is placed such that in the two adjacent shots, the first region of one shot overlaps the second region of the other shot.
Dependencies are inferred from the claim text.