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US 8,282,841 B2Granted
Printed circuit board and manufacturing method thereof
AssigneeFujikura Ltd.
InventorsKanako Nakajima, Masatoshi Inaba, Yoshiharu Unami
Life of this patent
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Abstract
A printed circuit board includes a flexible insulated substrate with a first surface and a second surface at both sides respectively, a wiring layer on the first surface, a reinforcement plate on a part of the second surface and an auxiliary layer between the second surface and the reinforcement plate. A reinforcement edge side of the reinforcement plate is located at the outside of an auxiliary edge side of the auxiliary layer.
Claims6
A method of manufacturing a printed circuit board, comprising:
- forming a wiring layer, by patterning, on a first surface of a thermoplastic and flexible insulated substrate;
- placing a reinforcement material on a second surface of the thermoplastic and flexible insulated substrate via a metal auxiliary material formed on the reinforcement material;
- forming a pattern mask layer to partially expose a surface of the reinforcement material;
- and
- shaping an metal auxiliary layer and a reinforcement plate by etching the exposed surface,
- wherein, an etching speed of the metal auxiliary material is faster than that of the reinforcement material.
3 more elements
Dependencies are inferred from the claim text.