Method for simultaneously cutting a compound rod of semiconductor material into a multiplicity of wafers

A method for simultaneously cutting a compound rod of semiconductor material into a multiplicity of wafers, the method comprising:

• selecting a first workpiece and a second workpiece from a set of workpieces cut from at least one semiconductor rod, wherein the first and the second workpieces each include two end surfaces;
• grinding at least one of the two end surfaces of each workpiece so as to create a ground end surface on each workpiece;
• cementing the ground end surface of the first workpiece to the ground end surface of the second workpiece using a fastener so as to produce a compound rod piece having a longitudinal axis, wherein the fastener is disposed between the workpieces so as create a distance between the workpieces;
• fixing the compound rod piece in a longitudinal direction on a mounting plate;
• clamping the mounting plate with the compound rod piece in a wire saw;
• and
• cutting the compound rod piece perpendicularly to the longitudinal axis using the wire saw,
• wherein the grinding step includes grinding at a defined angle with respect to a crystal lattice and orientation setting so as to cause the ground surfaces to be parallel to one another.

A method for simultaneously cutting a compound rod of semiconductor material into a multiplicity of wafers, the method comprising:

• selecting a first workpiece and a second workpiece from a set of workpieces cut from neighboring rod positions on a semiconductor rod, wherein the first and the second workpieces each include two end surfaces;
• cementing the end surface of the first workpiece to the end surface of the second workpiece using a fastener so as to produce a compound rod piece having a longitudinal axis, wherein the fastener is disposed between the workpieces so as create a distance between the workpieces;
• fixing the compound rod piece in a longitudinal direction on a mounting plate;
• clamping the mounting plate with the compound rod piece in a wire saw;
• and
• cutting the compound rod piece perpendicularly to the longitudinal axis using the wiresaw so as to form wafers from each of the first and second workpieces.