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US 8,282,754 B2Granted
Pressure sensitive shrink label
AssigneeAvery Dennison Corporation
InventorsJames Paul Lorence, Richard D. Pastor, Craig William Potter, Richard A. Previty, Mitchell J. Rackovan, Mark James Wyatt, William Lewis Cone
Life of this patent
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Abstract
A label for application to a surface having at least one compound curve is provided. The label comprises a heat shrinkable film having an inner surface and outer surface and a layer of pressure sensitive adhesive on the inner surface of the heat shrinkable film.
Claims25
A method of applying a label to an article, the method comprising:
- providing an article having a perimeter and having a surface comprising at least one compound curve;
- providing a label comprising (i) a heat shrinkable film having an inner surface and an outer surface;
- and (ii) a layer of pressure sensitive adhesive on the inner surface of the heat shrinkable film, wherein the label has a first edge and a contact region;
- contacting the adhesive layer in the contact region of the label with the article;
- applying heat and pressure simultaneously to the label in a direction from the contact region to the first edge such that the first edge of the label adheres to the article and the label shrinks to conform to the compound curve of the article;
- wherein the label adheres to less than half the perimeter of the article at a given cross-section.
3 more elements
Dependencies are inferred from the claim text.