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US 8,281,838 B2Granted
Work bonding and supporting method and work bonding and supporting apparatus using the same
AssigneeNitto Denko Corporation
InventorsYasuji Kaneshima, Masayuki Yamamoto
Life of this patent
Estimating the term…
Abstract
Tape heating means is allowed to come close to an adhesive tape for support and, in a heating state, the adhesive tape for support is stretched and tensioned with proper tension in a tape width direction and a transport direction. A heated work is bonded to an adhesive face of the tensioned adhesive tape for support, thereby supporting the work.
Claims8
A work bonding and supporting apparatus for bonding a work to an adhesive tape for support to support the work, comprising:
- a ring frame transport mechanism for carrying a ring frame in a tape bonding position;
- tape supplying means for supplying a continuous adhesive tape for support to the tape bonding position in a posture that an adhesive face of the adhesive tape for support faces the back side of the ring frame;
- tape tensioning means for stretching the adhesive tape for support supplied to the tape bonding position by holding at least one or both of facing sides in the width direction of the adhesive tape for support and front and rear sides in the supply direction of the adhesive tape for support;
- tape heating means for heating the adhesive tape for support supplied to the tape bonding position;
- tape bonding means for pressing the adhesive tape for support against the back side of the ring frame;
- a tape cutting mechanism for cutting the adhesive tape for support bonded to the back side of the ring frame along the ring frame;
- and
- work bonding means for supplying and bonding a work in a heated state to the adhesion face of the adhesive tape for support bonded to the ring frame.
5 more elements
Dependencies are inferred from the claim text.