Method of producing a circuit board layer
AssigneeRobert Bosch GmbH
InventorsPeter Tauber, Tuncay Sentuerk, Ulrich Speh
Life of this patent
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Abstract
A method for producing a circuit board layer, in particular for a multilayer circuit board, a ceramic foil upon which a carrier foil is disposed being used, the carrier foil being perforated by laser to form at least one circuit trace, and/or the carrier foil and the ceramic foil being perforated together by laser to form at least one feedthrough, the circuit trace and/or the feedthrough subsequently being created by printing, the carrier foil constituting a printing screen, and the carrier foil subsequently being removed from the ceramic foil.
Claims15
A method for producing a circuit board layer for a multilayer circuit board, comprising:
- perforating a carrier foil which is disposed upon a ceramic foil using a laser to form at least one circuit trace, or perforating the carrier foil and the ceramic foil together by laser to form at least one feedthrough, the circuit trace or the feedthrough subsequently being created by printing, wherein the carrier foil constitutes a printing screen, and
- subsequently removing the carrier foil from the ceramic foil.
Dependencies are inferred from the claim text.