US 8,281,468 B2 · Method of manufacturing piezoelectric vibrators

Abstract

Providing a method for manufacturing a package capable of improving production efficiency. Providing a method for manufacturing a package including: a base board and a lid board which are bonded to each other; an accommodated article which is sealed in a cavity formed between the base board and the lid board; and a penetration electrode which is disposed in a penetration hole penetrating through the base board so as to electrically connect the accommodated article to the outside, the method including: a penetration hole forming step of forming a penetration hole for the penetration electrodes 30b, 30b in the base board; a penetration electrode alignment step of inserting a core portion 7 of a conductive rivet member 9 into the penetration hole of the base board; a glass frit filling step of applying a paste-like glass frit 6a onto the other surface of the base board and filling the glass frit into the penetration hole; and a baking step of baking and curing the glass frit, wherein the glass frit filling step involves forming a glass frit filling portion 41 having a larger diameter than the penetration hole and filling the glass frit also into the glass frit filling portion.

Claims10

Dependent claims

A method for producing piezoelectric vibrators, comprising:

(a) defining a plurality of first substrates on a first wafer and a plurality of second substrates on a second wafer;
(b) forming at least one through hole in respective at least some of the first substrates, wherein a respective the at least one through hole comprises an electrode hole and an excess filler hole which is continuous from the electrode hole and open in a first surface of the first wafer;
(c) providing filler paste in the electrode hole and the excess filler hole of a respective at least some of the through holes;
(d) firing the first wafer to harden the filler paste in the at least some of the through holes;
(e) removing the first surface of the first wafer to reduce a thickness of the first wafer to substantially eliminate the excess filler holes from the first wafer and expose the hardened filler paste at the first surface of the first wafer;
(f) layering the first and second wafers such that at least some of the first substrates substantially coincide respectively with at least some of the corresponding second substrates, wherein a piezoelectric vibrating strip is secured in a respective at least some of the coinciding first and second substrate pairs;
and
(g) hermetically bonding at least some of the coinciding first and second substrate pairs.

5 more elements

Dependencies are inferred from the claim text.

Method of manufacturing piezoelectric vibrators

Life of this patent

Method of manufacturing piezoelectric vibrators

Life of this patent

Abstract

Claims10