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US 8,278,746 B2Granted
Semiconductor device packages including connecting elements
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYi-Chuan Ding, Chia-Ching Chen
Life of this patent
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Abstract
Described herein are wafer-level semiconductor device packages with stacking functionality and related stacked package assemblies and methods. In one embodiment, a semiconductor device package includes a set of connecting elements disposed adjacent to a periphery of a set of stacked semiconductor devices. At least one of the connecting elements is wire-bonded to an active surface of an upper one of the stacked semiconductor devices.
Claims20
A semiconductor package, comprising:
- a set of stacked semiconductor devices including:
- a first semiconductor device having an active surface and an inactive surface;
- and
- a second semiconductor device coupled to the inactive surface of the first semiconductor device;
- a set of connecting elements circumscribing the set of stacked semiconductor devices, the set of connecting elements including:
- a first connecting element including an upper end;
- and
- a second connecting element that is electrically connected to the second semiconductor device;
- a package body encapsulating the set of stacked semiconductor devices and the second connecting element, the package body having a lower surface that is substantially coplanar with the active surface of the first semiconductor device, wherein the upper end of the first connecting element is substantially exposed from the package body;
- and
- a redistribution layer that is formed over at least a portion of the active surface of the first semiconductor device and at least a portion of the lower surface of the package body, that is electrically connected to the active surface of the first semiconductor device, and that is electrically connected to the first connecting element.
8 more elements
A semiconductor package, comprising:
- a redistribution layer;
- a first conductive connector and a second conductive connector electrically connected to the redistribution layer;
- a molded structure encapsulating the plurality of conductive connectors, wherein:
- the first conductive connector extends from the redistribution layer and has an upper surface that is exposed at an upper surface of the molded structure;
- and
- the second conductive connector extends from the redistribution layer and has an upper surface that is encapsulated by the molded structure, and the upper surface of the second conductive connector is substantially coplanar with the upper surface of the first conductive connector.
3 more elements
A semiconductor package, comprising:
- a redistribution layer;
- a semiconductor device having an active surface facing towards and electrically connected to the redistribution layer;
- a plurality of connecting elements circumscribing the semiconductor device and disposed adjacent to the redistribution layer, the plurality of connecting elements including:
- a first connecting element;
- and
- a second connecting element that is disposed between the first connecting element and the semiconductor device;
- and
- a package body encapsulating the semiconductor device and the second connecting element;
- wherein the first connecting element has an upper surface that is exposed from the package body, and the active surface of the semiconductor device is substantially coplanar with a lower surface of the first connecting element and a lower surface of the second connecting element.
6 more elements
Dependencies are inferred from the claim text.