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US 8,275,188 B2Granted
System and method for inspecting chips in a tray
AssigneeCheng Mei Instrument Technology Co., Ltd.
InventorCheng Tao Tsai
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Abstract
A system for inspecting chips in a tray comprises a three-dimensional sensor, a focus computing unit, an image sensor and a focusing device. The three-dimensional sensor is used to obtain the height signals of surfaces of the chips. The focus computing unit calculates the focusing positions of chips. The surface inspection sensor is used to inspect the surfaces of the chips. The focusing device is used to bring the images of the surfaces of the chips into the focus of the image sensor.
Claims26
A system for inspecting chips in a tray, comprising:
- a three-dimensional sensor configured to provide a height signal of a surface of a chip in a tray;
- a focus computing unit configured to determine a focusing position of the surface of the chip by the height signal;
- an image sensor configured to inspect the surface of the chip;
- and
- a focusing device configured to position the image sensor to perform a focusing operation based on the focusing position, wherein the image sensor is attached to the focusing device.
2 more elements
A method for inspecting chips in a tray, comprising the steps of:
- scanning a plurality of chips in a tray and obtaining a height signal of each chip by a three-dimensional sensor;
- processing the height signal of each chip to determine focusing position thereof by a focus computing unit;
- adjusting a focus of an image sensor by a focusing device based on the focusing position of each chip;
- and
- inspecting the surface of each chip by the image sensor.
2 more elements
Dependencies are inferred from the claim text.