Method for fabricating micro speaker and micro speaker fabricated by the same
AssigneeSamsung Electronics Co., Ltd.
InventorsByung-gil Jeong, Hyung-jae Shin, Seok-whan Chung, Dong-kyun Kim
Life of this patent
Estimating the term…
Abstract
A method for fabricating a micro speaker is provided, including forming a package wafer and a device wafer by batch processing, bonding the package wafer and the device wafer to each other, and forming a diaphragm by isotropic-etching a back surface of the device wafer using a xenon difluoride (XeF2). As a result, a micro-electronic-mechanic system (MEMS) technology-based piezoelectric micro speaker having a wide frequency response range is realized, by batch processing, thereby providing simplified structure and processing and reducing fabricating cost.
Claims9
A method for fabricating a micro speaker, the method comprising:
- forming a package wafer and a device wafer by batch processing;
- bonding the package wafer and the device wafer to each other;
- and
- forming a diaphragm by etching a back surface of the device wafer,
- wherein the forming of the package wafer comprises:
- forming a back cavity on a back surface of the package wafer facing an upper surface of the device wafer, the back cavity providing a space for a movement of the diaphragm;
- forming a first metal along a surface of the back cavity by vapor-deposition;
- forming by piercing, an electrode connecting hole and a vent hole on an upper portion of the back cavity;
- and
- forming an electrode by performing one of vapor depositing a second metal along the electrode connecting hole, and plating the electrode connecting hole.
Dependencies are inferred from the claim text.