Back to results
US 8,274,798 B2Granted
Carrier substrate and method for making the same
AssigneeUnimicron Technology Corp.
InventorsShih-Jung Huang, Wen-Fang Liu, Ling-Kai Su
Life of this patent
Estimating the term…
Abstract
A carrier substrate includes a substrate having a chip side and a PCB side, a plurality of bond pads disposed on the chip side for bonding a chip, a plurality of land grid array (LGA) pads disposed on the PCB side, and a plurality of resilient flanges installed on the PCB side in an array manner. The plurality of resilient flanges electrically connects with the LGA pads correspondingly.
Claims9
A carrier substrate, comprising:
- a substrate having a chip side and a PCB side;
- a plurality of bonding pads on the chip side for bonding a chip;
- a plurality of land grid array (LGA) pads on the PCB side;
- and
- an array of flexible contact arms mounted on the PCB side and electrically connected to the LGA pads respectively, wherein each of the flexible contact arms is jointed to the PCB side of the substrate using low-flow prepreg, and wherein each of the flexible contact arms is electrically connected to each of the LGA pads through a plated via formed in the low-flow prepreg.
2 more elements
Dependencies are inferred from the claim text.