Electronic component
AssigneeOMRON Corporation
InventorsKazuyuki Ono, Yoshio Tanaka, Kiyoshi Nakajima, Naoto Kuratani, Tomofumi Maekawa
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Abstract
An electronic component has a printed substrate having a die bonding portion, a semiconductor element rigidly bonded to the die bonding portion of the printed substrate by a die bonding resin, and a wire bonding terminal formed by a conductor pattern on the printed substrate that is connected to the semiconductor element by a bonding wire. A groove portion located at a level lower than the conductor pattern of the printed substrate is formed in a region located on at least a die bonding portion side in a region surrounding the wire bonding terminal.
Claims5
An electronic component comprising:
- a printed substrate comprising a die bonding portion;
- a semiconductor element rigidly bonded to the die bonding portion of the printed substrate by a die bonding resin, and
- a wire bonding terminal formed by a conductor pattern on the printed substrate that is connected to the semiconductor element by a bonding wire, the wire bonding terminal comprising a die bonding portion side disposed adjacent to the die bonding portion and an opposite side disposed opposite to the die bonding portion side, wherein a solder resist layer is disposed on at least a portion of the opposite side,
- wherein a groove portion located at a level lower than the conductor pattern of the printed substrate is formed in a region located on at least the die bonding portion side in a region surrounding the wire bonding terminal,
- wherein the groove portion is open and is configured to receive excess die bonding resin.
Dependencies are inferred from the claim text.