Three-dimensional SoC structure formed by stacking multiple chip modules

A three-dimensional system-on-chip (SoC) structure formed by stacking multiple chip modules, the three-dimensional SoC structure comprising:

• at least two vertical SoC modules, each said vertical SoC module formed by stacking at least two said chip modules vertically, wherein each said chip module comprises:
• a module circuit board having a first surface and a second surface, the first surface sunken to form a recess having a first region, the second surface having a second region opposite the first region, wherein each of the first region and the second region is provided with a first connecting interface, the first surface is provided with a second connecting interface, and the second surface is provided with a third connecting interface;
• and
• at least one preset element electrically connected to a said first connecting interface;
• and
• at least one connector module comprising a connecting circuit board having an outer surface provided with a fourth connecting interface, each said connector module electrically connecting two said vertical SoC modules;
• wherein each said vertical SoC module is constructed in such a way that the second connecting interface of a said chip module contacts with and is therefore electrically connected to the third connecting interface of another said chip module.