Resin-sealed electronic control device and method of fabricating the same

A resin-sealed electronic control device, comprising:

• a first electronic board and a second electronic board, to each of which a plurality of external connection terminals are connected, each of the first electronic board and the second electronic board carrying a plurality of circuit components mounted thereon;
• a thermally conductive support member comprising an upper surface and a lower surface, on which the first electronic board and the second electronic board are respectively bonded to be fixed;
• and
• a synthetic resin serving as an exterior covering material for integrally molding the entire first electronic board, the entire second electronic board, a portion of each of the plurality of external connection terminals, and a portion of the support member, wherein:
• the support member is formed of a pair of thermally conductive separate beam members for retaining the first electronic board and the second electronic board at a distance from each other;
• a pair of opposite side end portions of the first electronic board and a pair of opposite side end portions of the second electronic board opposed to each other, the pair of opposite side end portions of the first electronic board being bonded to be fixed onto one of upper surfaces and lower surfaces of the pair of separate beam members with an adhesive, the pair of opposite side end portions of the second electronic board being bonded to be fixed onto another of the upper surfaces and the lower surfaces of the pair of separate beam members with an adhesive;
• at least one of the first electronic board and the second electronic board is a double-sided board comprising an inner surface on which an inner circuit component is mounted and an outer surface on which outer circuit components are mounted, the outer circuit components comprising heat-generating components being mounted on an outer surface of at least one of the first electronic board and the second electronic board;
• the heat-generating components are adjacent to and opposed to the pair of separate beam members with the adhesives interposed therebetween;
• the inner circuit component is arranged between the pair of separate beam members and has a smaller height size than a distance between the first electronic board and the second electronic board opposed to each other;
• and
• the exterior covering material fills a narrow space surrounded by the first electronic board, the second electronic board, and the pair of separate beam members.