Thermal interposer liquid cooling system

A thermal interposer for a heat-generating electronic component, comprising:

• a thermally conducting body configured to be thermally coupled to the electronic component, the thermally conducting body including,
• a first region located on a first face of the thermally conducting body, the first region being adapted to be in thermal contact with a surface of the electronic component,
• a second region located on a second face of the thermally conducting body, the second face being opposite the first face;
• a cold plate assembly removably coupled to the thermally conducting body and in thermal contact with the second region of the thermally conducting body, the cold plate assembly including,
• an inlet adapted to receive a cooling liquid into the cold plate assembly, and
• an outlet adapted to discharge the cooling liquid from the cold plate assembly;
• and
• at least one heat pipe extending from a location proximate the first region to a location proximate the second region.

A thermal interposer for a heat-generating electronic component, comprising:

• a thermally conducting body configured to be thermally coupled to the electronic component, the thermally conducting body including,
• a first region located on a first face of the thermally conducting body, the first region being adapted to be in thermal contact with a surface of the electronic component,
• a second region located on a second face of the thermally conducting body, the second face being opposite the first face;
• a first planar component which includes the first face and the second face opposite the first face, and
• a second planar component having a third face and a fourth face opposite the third face, wherein the second planar component is stacked on the first planar component such that the second face of the first planar component faces the third face of the second planar component;
• a cold plate assembly removably coupled to the thermally conducting body and in thermal contact with the second region of the thermally conducting body, the cold plate assembly including,
• an inlet adapted to receive a cooling liquid into the cold plate assembly, and
• an outlet adapted to discharge the cooling liquid from the cold plate assembly.

A liquid cooling system of a computer, comprising:

• a heat exchanger adapted for cooling a cooling liquid;
• one or more tubes configured to direct the cooling liquid between the heat exchanger and a planar thermal interposer assembly;
• and
• the thermal interposer assembly coupled to a first adapter card of the computer such that the thermal interposer assembly is substantial parallel to the first adapter card, the first adapter card being plugged into a motherboard of the computer such that the first adapter card is substantially perpendicular to the mother board, the thermal interposer assembly including,
• a first thermally conducting body in thermal contact with a first heat dissipating electronic component on the first adapter card;
• and
• a cold plate assembly removably coupled with the thermally conducting body, the cold plate assembly being configured to circulate the cooling liquid therethrough.