Methods and systems for using resistivity of sensor film in an element shunt

A system, comprising:

• a sensor stack formed of a plurality of thin film layers;
• a shunt formed of at least some of the same layers as the sensor stack, the shunt being spaced from the sensor stack;
• a first lead coupled to the sensor stack and the shunt;
• a second lead coupled to the sensor stack and the shunt;
• an upper shield above the sensor stack and in electrical communication therewith;
• a lower shield below the sensor stack and in electrical communication therewith:
• and
• an electrically nonconductive extra gap layer formed directly on the shunt,
• wherein the leads are positioned to pass a current through the sensor stack in a direction perpendicular to the plane of deposition thereof,
• wherein the leads are positioned to pass a current through the shunt in a direction parallel to the plane of deposition thereof,
• wherein the leads include portions overlying or underlying ends of the shunt,
• wherein a spacing of the portions of the leads define a resistance value of the shunt.