Display device comprising a protective fixing member disposed only about a periphery of a semiconductor chip wherein a top side and a bottom side are co-planar with a respective top side and a bottom side of the semiconductor chip

A display device comprising:

• a first substrate with a pixel switch and drivers mounted thereon;
• a second substrate disposed in facing relation to said first substrate;
• a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect;
• a semiconductor chip mounted as a chip on glass (COG) component on said first substrate, said semiconductor chip having a control system configured to control said drivers;
• a protective fixing member disposed on at least a portion of said first substrate only laterally of said semiconductor chip in a uniform manner so that a top side and a bottom side of the protective fixing member are co-planar with a respective top side and a bottom side of the semiconductor chip, the protective fixing member serving to fix the first substrate to the semiconductor chip and seal about a periphery of the semiconductor chip;
• an organic light-emitting diode (OLED) backlight illuminating said first substrate from a rear side of said first substrate through a diffusion sheet,
• wherein,
• said semiconductor chip has a thickness equal to or smaller than the distance from a surface of said first substrate which faces said material layer to a surface of said second substrate which faces away from said material layer, and
• each of said semiconductor chip and said second substrate includes a polished surface.

A display device comprising:

• a first substrate with a pixel switch and drivers mounted thereon;
• a second substrate disposed in facing relation to said first substrate;
• a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect;
• a polarizing plate and phase difference plate combination disposed on said second substrate remotely from said material layer;
• a semiconductor chip mounted as a chip on glass (COG) component on said first substrate, said semiconductor chip having a control system configured to control said drivers;
• a protective fixing member disposed only around a periphery of the COG component in a uniform manner between the COG component and the seal member on the first substrate so that a top side and a bottom side of the protective fixing member are co-planar with a respective top side and a bottom side of the COG component, the protective fixing member serving to fix the first substrate to the COG component and seal the periphery of the semiconductor chip;
• and
• an organic light-emitting diode (OLED) backlight illuminating said first substrate from a rear side of said first substrate through a diffusion sheet,
• wherein,
• said semiconductor chip has a thickness smaller than the total thickness of said seal member, said second substrate, and said polarizing plate and phase difference plate combination, and
• at least said semiconductor chip includes a polished surface.

The electronic apparatus having a display device, said display device comprising:

• a first substrate with a pixel switch and drivers mounted thereon;
• a second substrate disposed in facing relation to said first substrate;
• a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect;
• a semiconductor chip mounted as a chip on glass (COG) component on said first substrate, said semiconductor chip having a control system configured to control said drivers;
• a protective fixing member disposed on said first substrate only laterally around the semiconductor chip in a uniform manner so that a top side and a bottom side of the protective fixing member are co-planar with a respective top side and a bottom side of the semiconductor chip, the protective fixing member serving to fix the semiconductor chip to the first substrate and provide a seal about a periphery of the semiconductor chip;
• and
• an organic light-emitting diode (OLED) backlight illuminating said first substrate from a rear side of said first substrate through a diffusion sheet;
• and
• wherein,
• said semiconductor chip has a thickness greater than a thickness of the seal member, and the thickness of the semiconductor chip is equal to or less than a total thickness of said seal member and said second substrate;
• and
• each of said semiconductor chip and said second substrate includes a polished surface.

The electronic apparatus having a display device, said display device comprising:

• a first substrate with a pixel switch and drivers mounted thereon;
• a second substrate disposed in facing relation to said first substrate;
• a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect;
• a polarizing plate and phase difference plate combination disposed on said second substrate remotely from said material layer;
• a semiconductor chip mounted as a chip on glass (COG) component on said first substrate, said semiconductor chip having a control system configured to control said drivers;
• a protective fixing member disposed only laterally around the COG component in a uniform manner between the COG component and the seal member on the first substrate so that a top side and a bottom side of the protective fixing member are co-planar with a respective top side and a bottom side of the COG component, the protective fixing member serving to fix the first substrate to the semiconductor chip and seal about a periphery of the semiconductor chip;
• and
• an organic light-emitting diode (OLED) backlight illuminating said first substrate from a rear side of said first substrate through a diffusion sheet,
• wherein,
• said semiconductor chip has a thickness smaller than the total thickness of said seal member, said second substrate, and said polarizing plate and phase difference plate combination, and
• at least said semiconductor chip includes a polished surface.