# US 8,274,600 B2 · Camera module package

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- Number: US 8,274,600 B2
- Document ID: US8274600B2
- Status: Granted
- Kind: B2
- Application number: 12/588,958
- Filed: 2009-11-03
- Published: 2010-06-24
- Granted: 2012-09-25
- Earliest claimed: 2008-12-24
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Ho Kyoum Kim; Gab Yong Kim; Hyung Chan Kwak
- Web page: https://patentgrep.com/patent/US8274600B2

## CPC

- H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
- H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
- H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs
- H05K 2201/10121: Optical component, e.g. opto-electronic component
- H05K 2201/10151: Sensor
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A camera module package is disclosed. The camera module package is capable of preventing defects caused by foreign bodies and enhancing product reliability by reducing the time consumed in a packaging process for manufacturing a camera module, and of reducing the size of a package and manufacturing costs by excluding the use of gold wires.

## Claims

### Claim 1

A camera module package comprising:
a housing having an inner space in an upper portion thereof;
a lens barrel coupled to the housing through the inner space and receiving one or more lenses;
an image sensor including an imaging area converting light, falling thereon via the lens, into an electrical signal, and a sensor contact pad formed on an upper side thereof;
a board including a cavity receiving the image sensor, and an external contact pad formed on an upper side thereof; and
a connection part electrically connecting the external contact pad to the sensor contact pad,
wherein the cavity has substantially a same depth as a thickness of the image sensor such that the upper side of the image sensor and the upper side of the board are on a same level, and
wherein the connection part is provided using screen-printing and covers the sensor contact pad and the external contact pad integrally to electrically connect the sensor contact pad to the external contact pad.

### Claim 2 (depends on 1)

The camera module package of claim 1, wherein the cavity has a greater size than the image sensor to form a gap between the cavity and edges of the image sensor.

### Claim 3 (depends on 1)

The camera module package of claim 1, wherein the connection part is formed of a conductive material.

### Claim 4 (depends on 1)

The camera module package of claim 1, further comprising an adhesive provided between the image sensor and the cavity to fix the image sensor in the cavity.

### Claim 5 (depends on 4)

The camera module package of claim 4, wherein the adhesive is provided along edges of the image sensor to fix the image sensor in the cavity.

### Claim 6 (depends on 4)

The camera module package of claim 4, wherein the adhesive has a top surface on substantially the same plane as top surfaces of the image sensor and the board.

### Claim 7 (depends on 1)

The camera module package of claim 1, further comprising a filter provided on the image sensor to protect the imaging area of the image sensor from external foreign bodies.