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US 8,274,343 B2Granted
Stacked coplanar waveguides having signal and ground lines extending through plural layers
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorHsiu-Ying Cho
Life of this patent
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Abstract
An integrated circuit structure includes a semiconductor substrate; an interconnect structure over the semiconductor substrate; a first dielectric layer over the semiconductor substrate and in the interconnect structure; a second dielectric layer in the interconnect structure and over the first dielectric layer; and a wave-guide. The wave-guide includes a first portion in the first dielectric layer and a second portion in the second dielectric layer. The first portion adjoins the second portion.
Claims19
A method comprising:
- forming a first dielectric layer over a semiconductor substrate;
- forming a second dielectric layer over the first dielectric layer;
- and
- forming a wave-guide comprising:
- forming a signal line comprising a first portion in the first dielectric layer and a second portion in the second dielectric layer, wherein the second portion contacts the first portion, and wherein edges of the first portion are vertically aligned to corresponding edges of the second portion;
- and
- forming a first ground line and a second ground line on opposite sides of the signal line and in the first and the second dielectric layers, wherein at least one of the signal line, the first ground line, and the second ground line comprises a metal line portion and a via portion under the metal line portion, wherein the steps of forming the signal line and the first and the second ground lines comprise damascene processes.
4 more elements
A method comprising:
- forming a dielectric layer over a semiconductor substrate;
- forming a passivation layer over the dielectric layer;
- and
- forming a wave-guide comprising:
- forming a first portion in the dielectric layer;
- and
- forming a second portion in the passivation layer, wherein the first portion adjoins the second portion.
4 more elements
A method comprising:
- forming a plurality of dielectric layers comprising:
- forming inter-metal dielectric (IMD) layers over a semiconductor substrate;
- and
- forming a passivation layer over the IMD layers;
- and
- forming a wave-guide comprising:
- forming a signal line;
- and
- forming a first ground line and a second ground line on opposite sides of the signal line, wherein the signal line has a same thickness as the first ground line and the second ground line, and wherein the signal line and the first and the second ground lines extend into at least two layers in the IMD layers and the passivation layer.
6 more elements
Dependencies are inferred from the claim text.