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US 8,274,300 B2Granted
Thermal control unit for semiconductor testing
AssigneeKes Systems & Service (1993) Pte Ltd.
InventorsNaoto Sakaue, Fook Seng Kong
Life of this patent
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Abstract
A thermal control unit with a heat pipe that conducts heat away from a device under test during burn-in. The heat pipe has a heater that allows control of the rate at which heat is transferred from the DUT to the heat pipe. A sensor and controller are provided to control the heat in response to the measured temperature of the DUT. The sensor and controller control the heater to maintain the surface temperature of the DUT within a specified range.
Claims23
A thermal control unit comprising:
- a heat transfer block;
- a heat pipe that is a liquid-containing heat transfer component at least partially disposed in the heat transfer block, said liquid-containing heat transfer component having a proximate end and a distal end, said proximate end disposed in the heat transfer block;
- a sensor that senses the temperature of a device under test when the heat transfer block is placed into contact with the device under test;
- a heater positioned on the liquid-containing heat transfer component between the proximate and distal ends;
- a thermal regulator that controls the heater in response to the sensor;
- wherein the thermal regulator turns the heater on if the temperature of the device under test is below a threshold temperature and off if the temperature is at or above the threshold temperature.
3 more elements
Dependencies are inferred from the claim text.