Electronic component, mounting structure thereof, and method for mounting electronic component
AssigneeSeiko Epson Corporation
InventorNobuaki Hashimoto
Life of this patent
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Abstract
An electronic component includes: a functional piece having a predetermined function; a bump electrode formed on the functional piece, the bump electrode including a core with elastic property and a conductive film provided on a surface of the core; and a holding unit for holding a conductive contact state between the bump electrode and a connecting electrode which is electrically conducted to a driving circuit. The electronic component is coupled to the connecting electrode, and elastic deformation of the core causes the conductive film to make conductive contact with the connecting electrode.
Claims5
A quartz crystal resonator package, comprising:
- a quartz crystal piece;
- an excitation electrode which excites the quartz crystal piece;
- a housing sealing the quartz crystal piece;
- a connecting electrode formed on an inner surface of the housing;
- a bump electrode disposed between the lower surface of the quartz crystal piece and the housing, the bump electrode including:
- a resin part formed between the quartz crystal piece and the housing;
- a conductive part provided on a surface of the resin part, the conductive part contacting with the connecting electrode;
- and
- an adhesive holding the quartz crystal piece to the housing,
- wherein the conductive part is formed continuously to the excitation electrode.
An electronic component, comprising:
- a quartz crystal piece;
- an excitation electrode which excites the quartz crystal piece;
- a connecting electrode connecting to a driving circuit;
- a bump electrode disposed between the lower surface of the quartz crystal piece and the driving circuit, the bump electrode including:
- a resin part formed between the quartz crystal piece and the connecting electrode;
- a conductive part provided on a surface of the resin part, the conductive part contacting with the connecting electrode;
- and
- an adhesive holding a conductive contact state between the bump electrode and the connecting electrode,
- wherein the conductive part is formed continuously to the excitation electrode.
Dependencies are inferred from the claim text.