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US 8,274,166 B2Granted
Semiconductor device and method of manufacturing the same
AssigneeRenesas Electronics Corporation
InventorHirokazu Shimada
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a substrate; an alignment mark formed on the substrate and composed of a metal film; a cover insulating film formed on the alignment mark and covering an entire surface of the alignment mark; and a polyimide film formed on the cover insulating film, and having an opening, which is opened on the alignment mark and has an end face aligning with an end face of the alignment mark, in plan view.
Claims16
A semiconductor device, comprising:
- a substrate;
- an alignment mark disposed on said substrate, said alignment mark comprising a metal film;
- a cover insulating film disposed on said alignment mark, said cover insulating film covering an entire surface of said alignment mark;
- a pad electrode disposed in a same layer as said alignment mark on said substrate;
- and
- a polyimide film disposed on said cover insulating film,
- wherein said polyimide film comprises:
- a first opening, which is opened on said alignment mark, said first opening comprising an end face aligning flushly with an end face of said alignment mark, in plan view;
- and
- a second opening that is disposed in a region where said pad electrode is disposed and exposes a top surface of said pad electrode, and
- wherein said cover insulating film comprises an opening that is disposed in the region where said pad electrode is disposed and exposes the top surface of said pad electrode.
8 more elements
A semiconductor device, comprising:
- a substrate;
- an alignment mark disposed on said substrate comprising:
- a metal film;
- a cover insulating film disposed on said alignment mark, said cover insulating film covering an entire surface of said alignment mark;
- a pad electrode disposed in a same layer as said alignment mark on said substrate;
- and
- a polyimide film disposed on said cover insulating film, said polyimide film comprising:
- an opening, which is opened on said alignment mark, said opening comprising an end face aligning flushly with an end face of said alignment mark, in plan view;
- and
- an opening that is disposed also in a region where said pad electrode is disposed and exposes a top surface of said pad electrode,
- wherein said cover insulating film comprises an opening that is disposed also in a region where said pad electrode is disposed and exposes the top surface of said pad electrode, and
- wherein each of said alignment mark and said pad electrode includes a wiring film and a barrier metal film disposed on the wiring film, and said barrier metal film of said pad electrode, in a portion that is exposed from said cover insulating film, has a film thickness smaller than that of said barrier metal film of said alignment mark.
9 more elements
Dependencies are inferred from the claim text.